World-class quality in sample preparation The cutting-edge ion optics design in the Orage™ FIB column guarantees high resolution over the entire beam energy range, versatility, and best conditions for sample preparation. However, its excellent performance at low energies is what makes this column a world-class instrument for performing the most challenging nanofabrication tasks, including the preparation of ultra-thin TEM specimens of sub-20 nm processes with ultimate quality after final low-kV polishing.
Maximum versatility in sample preparation to your lab Whether used at low ion beam currents for fabricating delicate nanostructures, or high currents for fulfilling large-volume milling requirements, the Orage™ column – capable of generating maximum currents of up to 100 nA while preserving beam quality – offers incomparable versatility to satisfy a wide range of FIB applications.
Nanofabrication with ultimate quality Keeping up with an ever-increasing number of FIB milling applications that demand low beam energies, the Orage™ column operates at energies down to 500 eV thus providing the possibility of gentle milling to complete tasks such as TEM sample final polishing with minimal amorphization. Surface preparation is possible for EBSD microanalysis, or delicate surface final polishing in delayering applications of sub-20 nm chips for the purposes of architecture characterization.
Making the most of ion beam capabilities A fast, efficient and high-performance gas injection system (GIS) is essential for all FIB applications. The new OptiGIS™ has all these qualities and the S9000G can be equipped with up to 6 units of OptiGIS, or optionally, with an in-line multi-nozzle 5-GIS system that gives maximum versatility in multi-purpose installations. In addition, different proprietary gas chemistries and proven recipes for planar IC delayering are also available.
Maximum precision and optimal FIB performance with ease The Orage™ FIB column is fitted with an ultra-stable HV supply and precise piezo-driven aperture changer, which allows fast switching between FIB presets and excellent repeatability. In addition, a semi-automated spot-optimizing wizard allows users to easily select the best beam spot that optimises FIB milling conditions for a particular application.
Improved and extended imaging capabilities The in-beam detection system in the next generation Triglav™ column has been optimised resulting in more than a three-fold enhancement of signal detection efficiency. In addition, the detection capabilities have been extended and energy-filtered axial BSEs signal collection is now possible. This makes it possible to explore with new contrasts and provides enhanced surface sensitivity by selectively collecting low-loss BSEs.
Enhanced surface sensitivity and meaningful contrast Electron-signal selective detection capabilities available in the next generation Triglav™ column gives users complete control on surface sensitivity and the option to explore with different contrasts. Images containing topographic or material contrast, or both, can be acquired simultaneously for maximum insight of the sample in minimum time.
Fast 3D microanalysis The new and enhanced in-lens detection system enables fast image acquisition, which in combination with high ion beam currents up to 100 nA, results in fast data acquisition for 3D ultrastructural studies and 3D microanalytical sample characterisation. EDS and EBSD data can be simultaneously obtained during the FIB-SEM tomography and post-processed with dedicated software to obtain 3D sample reconstructions that provide researchers in life sciences or nanomaterials with unique insight and concrete answers.
Best conditions for microanalysis guaranteed The new generation of Triglav™ also comes with adaptive spot shape optimization, which results in improved resolution at high electron beam currents. Such a feature is beneficial for fast analytical techniques such as EDS, WDS, and EBSD. In addition, the Schottky FE gun is capable of generating beam currents up to 400 nA with rapid beam energy changes guaranteeing excellent signal for all microanalytical applications.
Large wafer analysis Optimal 60° objective geometry design, and a large chamber, enables SEM and FIB analyses of 6” and 8” wafers at any location.
Complex applications easier than ever The new TESCAN Essence™ software platform is a simplified, multi-user user interface with a layout manager that enables fast and easy access to main functions. This user-friendly interface can be customized to best fit particular application, user skill level and preference. A wide range of SW modules, wizards and recipes make the FIB-SEM applications, easy and smooth experience for both novice and expert users, thus boosting productivity and contributing to increase throughput in the lab. The new TESCAN Essence™ also offers the Advanced DrawBeam™, vector-based scanning generator for fast and precise FIB machining and Electron Beam Lithography.